SMT IPQC 巡检查核表 XLSX 2页

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一、人员/ 作业 (operation)
1.作业站是否有相对应的WI? 是否按WI作业.
Is the correspondig WI in the operation station? operator working follow WI?
2.作业员是否有上岗証且上岗証是否在有效期内.
Are operator own certificate and this certificate is eligible?

二、ECN
1.ECN内容.编号.说明.
ECN content ,NO.and description.

三、PCB
查核PCB板料号及版本.
check PCB P/N and edition.

四、印刷 (Printer)
1. 锡膏厂牌、规格符合要求或 WI ? (厂牌、规格)
Is the solder paste vendor match customer request?
2.锡膏取出、开启、使用期限是否符合要求?
Taking out of solder paste/opening and using accord to demands ( 记录编号、开启时间)
3.印刷参数是否与参数表一致.
Is printing  prameter  accord to Parameter  List?
4. 锡膏厚度量测绘制Xbar-R Chart 是否正常 ?
Is the Xbar-R chart of solder paste thickness show normal?
5.印刷品质是否符合标准要求. ( 5 PCS/2H)
Is the printing quality up to criteria's par.?

五、A级材料 (A level material)
1.防潮柜温湿度记录.( 温度/湿度)
Temperature and Humidity record.
2.防潮柜内元件是否在拆封保存及烘烤后有效期内?
Whether the component in dry oven storaged marked ?

六、贴片机 (Placer machines)
1.各站物料的料号、规格是否与排料表、程序相符.
Is the material and program accord with respective model's Material List?
2.换料是否量测记录并交叉核对.
Is the operation of exchanging material accord to WI?
3.MTS上料时IC方向、层数是否与料表相符.
IC direction feed as cutline.
4.BIOS及Flash 的版本或分位的确认( CS或标示 )
Verify BIOS and Flash IC version or F/W.
5.贴片后位置方向是否符合标准.( 5PCS/2H )
Is the component location accord with criteria?

七、回焊炉 ( Reflow)   
八、目检 (V/ I )
九、ICT及F/T测试 (ICT & F/T Test)
十、维修(Maintain)
十一、包装(Packing)
十二、MES/Q&CTS
十三、静电防护(ESD)   
十四、仪器、设备(Equiment & Facility)
十五、SPC
十六、换料查核 Change materail verify ( 记录查核站别)